Diamond lapping pad is used in the lapping and thinning process of hard and brittle materials such as glass substrates (microcrystalline, quartz, borosilicate, white board, sapphire), semiconductor wafers (monocrystalline silicon, silicon carbide), piezoelectric terminals (lithium tantalate), and precision ceramics (aluminum oxide, aluminum nitride, silicon nitride).
Optical glass: float glass/K9/quartz/BK7/fused silica/microcrystalline/prism, etc., infrared silicon-germanium, ceramic substrates
Features of diamond lapping pad:
* Shallower subsurface damage layer, beneficial for subsequent processing.
* Energy-saving and environmentally friendly, providing a cleaner working environment;no need to build a waste liquid sedimentation tank.
* Lower production costs compared to using free abrasives.
Diamond lapping pad is mainly used with BD-009 Polishing Slurry. As an effective polishing tool for lapping section of plane grinding, hexagonal resin diamond polishing pads can better store liquid and increase grinding efficiency of the plane by 50%.
