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Your Position: Home > Abrasives & Consumables > Polishing Pad > Diamond Thinning/Polishing Pad for polishing sapphire,wafer,presicion ceramic

Diamond Thinning/Polishing Pad for polishing sapphire,wafer,presicion ceramic

Application Material:
Semiconductor wafers (single-crystal silicon, silicon carbide)
Glass substrate(microcrystalline, quartz, borosilicate, white glass, sapphire)
Piezoelectric substrates (lithium tantalate)
Precision ceramics(alumina, aluminum nitride, silicon nitride)
material
sapphire substrate
wafer
Lithium tantalate wafers
silicon nitride ceramics
Diameter [mm]
200
254
300
370
515
530
910
1055
1145
abrasive
2
4
6
9
20
45
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Moresuperhard diamond polishing pad provide stable hardness control, consistent micro-porous structure, and customizable grooving patterns for demanding polishing environments.

1
The contact surface features a micro-repeating structure, ensuring a uniform and rapid grinding effect.
2
Excellent chip evacuation, preventing chip accumulation and eliminating secondary scratching.
3
Elasticity, superior surface quality of workpieces after lapping
4
The abrasive particles are fixed to the polishing pad, long service life; enhances abrasive utilization efficiency, reduces costs and more environmentally friendly.
5
Diameter: 200mm, 254mm, 300mm, 370mm, 515mm, 530mm, 910mm, 1055mm, 1145mm
6
Abrasive size: 45micro 20micro, 9micro, 6micro , 4micro, 2micro
7
Microstructure: block (2.6mm*2.6mm*0.9mm)
8
Substrate class ：PET composite PC board
diamond polishing pad
diamond polsihing pad attach single disc polishing machine
Advantages of diamond polishing pad
Diamond polishing pads are utilized for polishing of hard and brittle materials, such as microcrystalline glass, quartz glass, optical flat glass, sapphire window sheets, silicon carbide semiconductor sheets,alumina ceramics, and aluminum nitride ceramics.
High processing efficiency and reduced energy consumption;Elasticity, superior surface quality on the workpiece after lapping;
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