Diamond Lapping Pad Application: Sapphire, SiC, glassy materials and crystals For single or double surface lapping machine Diameter: 200mm, 254mm, 300mm, 370mm, 515mm, 530mm, 910mm, 1055mm, 1145mm Microstructure: block (2.6mm*2.6mm*0.9mm) Substrate class ：PET composite PC board Abrasive size: 45micro 20micro, 9micro, 6micro , 4micro, 2micro

The advantage of Engis' diamond lapping system is that it can provide comprehensive solutions for ultra-precision polishing technology. At the demo lab, our expertenginners make use of their experience and cultivated know-how to conduct activitiesto meet a wide variety of needs.