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Diamond lapping pad
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Your Position: Home > Consumables Tools > Consumables Tools > Diamond lapping pad

Diamond lapping pad

Abrasive size: 45micro 20micro, 9micro, 6micro , 4micro, 2micro
Diameter: 200mm, 254mm, 300mm, 370mm, 515mm, 530mm, 910mm, 1055mm, 1145mm
Application: Sapphire, SiC, glassy materials and crystals
Microstructure: block (2.6mm*2.6mm*0.9mm)
Substrate class ：PET composite PC board
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used in the lapping and thinning process of hard and brittle materials such as glass substrates , semiconductor wafers, piezoelectric terminals, and precision ceramics

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