Your Position: Home > Abrasives & Consumables > Polishing Pad > PU Polishing Pad
PU polishing pad
PU polishing pad
PU polishing pad
PU polishing pad
PU polishing pad
PU polishing pad
PU polishing pad
PU polishing pad

PU Polishing Pad

Polyurethane Polishing Pad, CMP polyurethane pad

Abrasive: Cerium Oxide and Zirconium Oxide, some pads none filler
Model: , MSH-13, MSH- 26,MSH-46,MSH- 57,MSH-66,MSH-77,MSH-LAERS
Thickness: 0.02″ (0.508 mm) – 0.20″ (5.08 mm)
CMP Polishing Pad for polsihing flat glass, LCD/LED substrates, precision optics components, hard disk, metal, wafer...
Grooved and without groove PU Polishing Pad
material
optical components
wafer
Diameter [mm]
23" x 55"
36" x 71"
42"x 42"
52"x 52"
abrasive
cerium oxide
zirconium oxide
none filler abrasive
Share With:

High quality polyurethane polishing pad designed for advanced CMP polishing processes in semiconductor wafers,LCD/LED substrates,hard disk,optical glass and display panels.

1
CMP Polishing pad refers to a pad featuring a microporous structure, primarily manufactured using a polyurethane foaming process.
2
Processing Materials: Semiconductor Substrates/Wafers, Precision Optical Components,LCD/Flat Panel Displays,, Disk Storage Substrates, Disk Drive Heads, and Sapphire.
3
Minimum thickness of grooved polishing pad: 1 mm
4
Standard groove depth: 1/2 of the polishing pad thickness.
5
Custom grooved PU pad service
6
Shape: Rectangle, Square,Round
PU polishing pad
Advantages of PU polishing pad
Moresuperhard as CMP pad supplier, can produce PU polishing pad grooved in various patterns to facilitate the flow of polishing fluid, carry away abrasive debris, and enhance heat dissipation.

Thicknesses ranging from 0.02" to 0.2"can be produced, with a maximum achievable thickness of 1 inch; other thicknesses can also be customized to suit various applications.

Facing polishing challenges

CMP polishing pad is engineered to solve common polishing challenges, such as:

  • Scratches during CMP processing
  • Rapid pad wear
  • Non-uniform polishing results

With optimized micro-porous polyurethane structure and customizable groove design, our custom grooved PU pad ensures stable polishing performance in both small batch and high-volume production environments.

Model Overview

Model Filler Average Density G / cm³ (Ib / ft³ ) Average Hardness shore – A Application Area
MSH- 13 cerium oxide 0.35 (22) 66 Glass Crystal
MSH- 26 zirconium oxide 0.57(36) 88 Glass Crystal
MSH-46 zirconium oxide 0.40 (25) 74 Glass Crystal
MSH- 57 none 0.51 (32) 88 Glass Metal Ceramic Crystal
MSH- 66 cerium oxide 0.42 (26) 78 Glass Crystal Metal Ceramic
MSH- 77 cerium oxide 0.43 (27) 78 Glass Crystal
MSH- 87 none 0.77 (49) 96 Glass Metal Ceramic Crystal
MSH- LASER zirconium oxide 0.59 (37) 90 Glass Metal Ceramic

Assistance & Information Contact us

Committed to providing you with quality answers, we invite you to send us a message with your contact details so that our staff can answer you as soon as possible.
info@moresuperhard.com
+86 17324838957
+86 17324838957

    INQUIRY NOW


    Contact us for a quote

    X