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Resin diamond lapping pad

Hexagon Resin diamond lapping pad

Sapphire, SiC, glassy materials and crystals lapping
Match single or double surface lapping machine
Abrasive size: 45micro 20micro, 9micro, 6micro , 4micro, 2micro
Diameter [mm]
127mm
180mm
610mm
710mm
820mm
920mm
980mm
1100mm
1480mm
abrasive
Diamond
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1
During the processing stage, the grinding pad can shed layer by layer, thereby providing a sustained and stable grinding rate.
2
Groove design facilitates chip evacuation, preventing secondary scratching of the workpiece caused by the accumulation of grinding debris during the sanding process.
3
The unique honeycomb structure enhances the capacity for storing abrasives and debris ensures the efficiency of the grinding process and the stability of surface quality.
4
Optical glass, glass-ceramics, quartz glass, ceramics, stainless steel, sapphire, silicon wafers, and other crystalline materials polishing
resin lapping pad

Replacing Traditional Copper Plates

Compared to the traditional process utilizing grooved copper plates and diamond polishing slurry, resin honeycomb lapping pads eliminate the need for downtime for conditioning, prevent thermal deformation, reduce costs, and significantly enhance both production efficiency and product quality.

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