1
During the processing stage, the grinding pad can shed layer by layer, thereby providing a sustained and stable grinding rate.
2
Groove design facilitates chip evacuation, preventing secondary scratching of the workpiece caused by the accumulation of grinding debris during the sanding process.
3
The unique honeycomb structure enhances the capacity for storing abrasives and debris ensures the efficiency of the grinding process and the stability of surface quality.
4
Optical glass, glass-ceramics, quartz glass, ceramics, stainless steel, sapphire, silicon wafers, and other crystalline materials polishing