Nano-scale diamond particles naturally possess high surface energy and may form agglomerates if dispersion is not properly controlled.
Particle agglomeration can negatively affect polishing consistency and may increase the risk of surface defects during precision polishing operations.
Diamond particles have significantly higher density than carrier liquids.
Without proper suspension systems, abrasive particles may gradually settle during storage, potentially affecting slurry consistency and process stability.
Variations in particle size distribution can influence material removal behavior and polishing consistency.
The slurry system is designed to support:
Actual performance depends on storage conditions, application methods, polishing equipment, and process parameters.
Suitable for precision polishing of optical glass, optical crystals, and photonic components.
Suitable for final polishing of metallographic specimens and material analysis samples.
Used in wafer polishing and precision surface finishing applications.
For sapphire wafers and optical sapphire components.
Suitable for polishing alumina, zirconia, silicon carbide and other engineering ceramics.
For mold components, carbide tooling and precision mechanical parts.